Ascend 950 Orders Exceed 400,000 Units: Domestic AI Computing Reaches Critical Inflection Point

In April 2026, a significant development emerged in China’s AI computing sector: tech giants including ByteDance and Alibaba collectively placed orders for Huawei’s Ascend 950 chips, with total volume approaching 450,000 units and procurement value around 475 billion RMB. This figure represents over half of Huawei’s annual shipment plan, triggering a 20% price increase while … Read more

Alibaba T-Head Expands Chip Portfolio with First Smart Network Card “Panmai 920” for Large-Scale AI Clusters

On April 28, 2026, in Fuzhou, China — At the 2026 Digital China Construction Summit, Alibaba’s semiconductor subsidiary T-Head officially unveiled its first smart network card product, “Panmai 920.” Specifically designed for AI computing clusters with over 10,000 GPUs, this new product marks T-Head’s completion of a comprehensive “computing-storage-networking” chip layout. Three Years in the … Read more

Anker Launches Self-Developed Thus Chip: Ushering in a New Era of AI Audio

Small Chip, Revolutionary Change On April 22, consumer electronics giant Anker officially unveiled its self-developed Thus chip, sparking widespread industry attention. The company claims this chip is the “world’s first neural network in-memory computing AI audio processor,” which will fundamentally change our understanding of AI capabilities in small audio devices like earbuds. During the launch … Read more

Google Unveils TPU 8t/8i: First-Ever Separation of Training and Inference, Targeting Nvidia

Core Event On April 22 local time, Google officially released two artificial intelligence chips—the TPU 8t and TPU 8i—at the Cloud Next 2026 conference in Las Vegas. This marks Google’s first-ever separation of AI training and inference tasks into distinct processors, representing a significant strategic transformation in the company’s AI chip domain. Technical Breakthrough: First … Read more

FibreSeeker 3: Consumer-Grade Continuous Fiber 3D Printer

FibreSeeker 3

In early 2026, FibreSeek (CarbonSeek Technology)—an emerging brand hailing from Shenzhen, China—soared to the top of crowdfunding charts with its debut product, the FibreSeeker 3. Amassing $4.6988 million in funding and garnering the support of 1,539 backers worldwide, the device achieved a remarkable breakthrough: it lowered the barrier to entry for industrial-grade continuous fiber 3D … Read more